CEI offers a wide range of technical capabilities for bare PCB manufacturing. Please click here for technical data sheets and other downloads.
We have more than 6 CAM operators using the latest version of Frontline Genesis 2000 (Valor) software.
Our CAM operators are very experienced, and run the appropriate Design Rules Checks (DRC) and review your designs for Design for Manufacturability (DFM). We offer:
- CAM availability from 6:00AM to 11:00PM Arizona Time
- 10 Seats of Frontline Genesis 2000 (Valor) software
- Netlist comparison
- ODB++ capability
- DRCs and DFM on each job!
- Professional reporting of CAM issues
- Fast resolution of jobs that are placed "On-Hold"
- Impedance Modeling and Stackups done with Polar SI8000 Software
We have a great deal of expertise in producing complex PCBs. We offer:
- 0 to 28 Layers!
- Vast Blind and Buried Via Experience
- Laser-Drilled and Copper-Filled Microvias
- High Aspect Ratios of 10:1 and Greater
- Extensive Controlled Impedance Experience Utilizing Polar SI8000 Software
- TDR Testing for Differential and Characteristic Impedance Using Polar CITS500 TDR Tester
- Via-in-Pad Technology Using Conductive and Non-Conductive Fill Materials (CB-100, Peters, San-Ei Kagaku)
- Large Materials Selection Including RoHS, Rogers, Nelco 4000-13, FR408, Polyimide, 370HR and More!
- Automatic Optical Inspection (AOI) for all Inner Layers
- MIL-PRF-55110 Certified with Plasma Etchback
- AOI (Automated Optical Inspection) for Inner Layer Verification
- .003 Line/Space Capability
- Cupric Chloride Etcher for Accurate Inner Layer Lines/Spaces
- Drilling with .008 bits with .005 Finished Hole Size for .062 PCBs
- Drilling with .006 bits with .003 Finished Hole Size for .040 or less PCBs
- High Aspect Ratios of 10:1 and Greater
- X-Ray for Accurate Multilayer Drilling
- Laser Drilled Microvias; Types I and II
We offer an array of board finishes including:
- HASL - Hot Air Solder Level
- ENIG - MacDermid Electroless Nickel Immersion Gold
- Immersion Silver - MacDermid Sterling
- Immersion White Tin
- Full Body Electrolytic Gold 30-50 microinches
- Gold Fingers (Tips) Plating
- Electrolytic Nickel and Tin-Nickel Plating
- Bondable Gold (Outside Process add 2 days)
- Selective Plating Finishes (Gold, Nickel)
- X-Ray Fluorescence for Accurate Metal Measurements
- IPC-600, IPC-6012 Classes 1, 2, 3, and 3A
- ISO 9001:2008 and AS9100:2004 Rev B Certified
- Alliance International Registrar Certificate #1714 - MIL-PRF-55110G for Double-Sided and Multilayer with Etchback (Military approved supplier for more than a decade!)
- ITAR Registered
- U.L. Approved Registration #E78104
- Calibrated Equipment to ANSI Standards
- Materials Purchased to IPC/4101
